Description
Spec. Standard Configuration Model AMD Ryzen AI 9 HX 370 manufacturing process TSMC 4nm FinFET core 12 cores and 24 threads cache L2: 12MB L3:24MB base speed 2 GHz Maximum speed 5.1 GHz power (TDP) 54W Model AMD Radeon™ 890M core 16 speed 2900 MHz resolution / Model SO-DIMM DDR5 *2 speed DDR5-5600 MT/s Capacity Up to 64GB SSD Capacity 1TB SSD (Up to 2TB) SSD Type M.2 2280 NVME PCIE 4.0 *2 x 8GB 2.5 inch HHD / TF card / BIOS Support Real-time clock, timed power-up BIOS Support Supports automatic boot after power-on BIOS Support Support uefi diskless boot CPU Integrated TPM Supports TPM 2.0(integrated in CPU) video output HDMI*1+DP*1+TYPEC*1 status indicator S0: White, S3: White breathing, S5/G3: off Spec. Standard Configuration Model M.2 E_Key protocols IEEE 802.11 a, b/g, n, ac,ax (wifi 6) Model M.2 E_Key protocols Support Bluetooth 5.2 built-in NO built-in NO LAN1 10M/100M/1000M/2.5G Adaptive Spec. Standard Configuration USB2.0 / USB2.0 Expansion / USB3.0 “Front USB3.2 GEN2 Type-A*2 Rear USB3.2 GEN1 Type-A*4” USB3.0 Expansion / Expanded External Storage / video output HDMI 2.0(Max 4096 x 2304 @ 60Hz) * 1 4K audio and video output DP1.4(Max 4096 x 2304 @ 60Hz) * 1 video output / serial port / Gigabit Ethernet 10/100/1000M/2.5G*1 screen interface / Backlight Voltage / data transmission TYPEC*1 Data: 10&40Gbps/Display(4K 60Hz)/PD 100W Power Button *1 Power Supply Input DC Jack x1 5.5/2.1mm Power Supply Input / Audio-out / Audio-in / Audio-in/out 3.5mm Phone Jackx1(Audio Jack) speaker output / serial output / serial output / FPC Antenna 1 WiFi 2.4+5G+BT x1 FPC Antenna 2 WIFI 6.0 micro SIM not support Spec. Standard Configuration Working Temperature 0~45? Memory Temperature -20~70? Humidity 5%-95% @ 40 °C (no condensation) ?T MAX: 23 °C
